eng, K. and Chiu, C.-h. 2001. A new analysis of load-penetration curves from instrumented indentations, Acta mater 49, 3539-3551.
Chiu, C.-h. 1999. The self-Assembly of uniform heteroepitaxial islands. Appl. Phys. Lett. 75, 3473—3475.
Y. W. Zhang, S. J. Xu, and C. –h. Chiu. 1999. Vertical self-alignment of quantum dots in superlattice. Appl. Phys. Lett. 74, 1809—1811.
A. S. Zuruzi, C.-h. Chiu, W. T. Chen, S. K. Lahiri, and K. N. Tu. 1999. Interdiffusion of high-Sn/high-lead (PbSn) solders in low temperature flip chip joints during reflow. Appl. Phys. Lett. 75, 3635—3637.
A. S. Zuruzi, C.-h. Chiu, S. K. Lahiri, and K. N. Tu. 1999. Roughness evolution of Cu6Sn5 intermetallic during soldering. J. Appl. Phys. 86, 4916—4921.
Chiu, C.-h. & Gao, H., 1995. A numerical study of stress controlled surface diffusion during epitaxial film growth. Mat. Res. Soc. Symp. Proc. 356, pp. 33—44.
Chiu, C.-h. & Gao, H. 1993. Stress Singularity along a cycloid rough surface. Int. J. Solids Structures 30, pp. 2983—3012.
Gao, H., Chiu, C-h. & Lee, J., 1992. Elastic contact versus indentation modeling of multi-layered materials. Int. J. Solids Structures 29, pp. 2471—2492
