Materials Science & Engineering

Module credits: 4

Workload: 3-0.5-0-0.5-6

Prerequisite(s): A-level physics

Introductory aspects of materials science and engineering (i.e. structure, properties and function). Structure on the Atomic scale. Energy levels, atomic orbitals, molecular orbitals; Interatomic bonding, types of bonds (metallic, ionic, covalent, molecular and mixed); Structure of metals, ceramics and polymers. Basic quantum mechanics ideas and introductory band theory; Basic crystallography, imperfection in solids, point and line defects, non-crystalline and semi-crystalline materials, diffusion and diffusion controlled process; Correlation of structure to properties and engineering functions (mechanical, chemical, electrical, magnetic and optical). Discussion of examples for main materials categories (metals, ceramics, polymers, composites and biomaterials).

Module credits: 4

Workload: 2-0.5-1.5-0.5-5.5

Prerequisite(s): A-level physics

Overview: symmetry, bonding, coordination number, packing fraction, order and disorder; Noncrystalline state: short-range order (SRO), pair distribution function, random walk, network and fractal models; Crystalline state: basic crystallography and structures, reciprocal lattice, quasicrystals, liquid crystalline state; Crystal vibrations, Brillouin zone; free electron model, energy bands; Structural effects on phase transformation.

Module credits: 4

Workload: 2-0.5-1.5-0.5-5.5

Prerequisite(s): A-level physics

Thermodynamic laws and relationship, concept of entropy and its relationship to heat, strategy for deriving thermodynamic relationships, general criterion for equilibrium, physical and chemical equilibria; Statistical thermodynamics: micro-states and macro-states, partition function; Phase diagram: unary and multicomponent systems, Clausius-Clapeyron equation, partial molar properties, Gibbs phase rule, applications of phase diagrams; Curvature effects in thermodynamics: surface excess properties, surface tension, phase equilibria, Gibbs adsorption equation; Basic electrochemistry.

Module credits: 4

Workload: 2-0.5-1.5-0.5-5.5

Prerequisite(s): MLE2102

Diffusion in solid-state: Fick’s first and second laws of diffusion, diffusion mechanisms; Diffusional & diffusionless transformations: solidification, phase transformation in solid, nucleation and growth, solidification of alloys and eutectics, TTT diagram, equilibrium and non-equilibrium states, spinodal transformation, martensitic phase transformation; Applications of phase transformations: precipitation, grain growth, devitrification, development of microstructures and nanostructures.

Module credits: 4

Workload: 2-0.5-1.5-0.5-5.5

Prerequisite(s): MLE1101 or EG1109

Stress and strain of material; Elastic deformation: Young’s modulus, Poisson’s ratio, stress-strain relation, stiffness/compliance matrix; Dislocations: Edge/screw/mixed dislocation, burgers vectors, twining, stress field of dislocation, dislocation interaction; Plastic deformation of single and polycrystalline materials: Schmid’s law, plastic flow; Inelastic deformation: Viscosity, deformation of inorganic glasses, deformation of noncrystalline and crystalline polymers; Mechanical fracture: ductile and brittle facture, creep, fatigue; Testing methods

Module credits: 4

Workload: 2-0.5-1.5-0.5-5.5

Prerequisite(s): MLE1101

Overview of quantum mechanics and band structures; conductivities in materials: metal, semiconductor, isolator and ionic conductors; electrical conductivity in metals: resistivity of metals and alloys, Matthiessen’s rule, Sommerfeld’s model; semiconductors: intrinsic, extrinsic, doping effect, p-n junction, bipolar transistors and MOSFETs; optical properties of materials: light emitting, fluorescence, luminescence and phosphorescence.

Module credits: 4

Workload: 2-0.5-1.5-0.5-5.5

Prerequisite(s): MLE1101

Corrosion of metals and alloys: Economics of corrosion, Thermodynamics and electrochemistry of corrosion, Types of corrosion, Environmental effects on corrosion, Corrosion of selected metals and alloys, Corrosion protection, Corrosion monitoring; Degradation of non-metallic materials: Biological, chemical and photodegradation of polymers, Environmental degradation, Photocorrosion of semiconductors; Failure mechanisms of materials. Failure analysis and Non-destructive testing: techniques and methodology, case histories

Module credits: 4

Workload: 2-0.5-1.5-0.5-5.5

Prerequisite(s): MLE1101

Engineering aspects of materials design and selection; Basics and procedure for materials selection: selection strategy, screening and ranking, deriving property limits, materials processes; Various aspects and factors in materials selection and design: functions, objectives, constraints and limits, performance maximizing criteria, environmental condition, economics and business issues; Case studies: metals, ceramics, semiconductors, polymers and biomaterials; Case study by industrial practitioners.

Module credits: 3

Workload: 1.5-0.5-1.5-0.5-3.5

Prerequisite(s): MLE1101

Classification of polymers, polymer structure, molecular weight distribution; Basic synthetic and characterization methods; Amorphous state and glass transition, crystalline state; General properties of polymers: physical, chemical, mechanical and electrical; Engineering and specialty polymers: processing and applications; Polymer-based composite materials: fabrication, structure and properties.

Module credits: 3

Workload: 1.5-0.5-1.5-0.5-3.5

Prerequisite(s): MLE1101

Polarization mechanisms; ferroelectricity and piezoelectricity; domain structure and hystereisis; permittivity and dielectric loss; optical properties of dielectric materials; fundamental of magnetism: magnetic moment, magnetic coupling and magnetic anisotropy; technical magnetization: domain structure, magnetic hysteresis; introduction to magnetic materials.

ME5161 Optical Techniques in Experimental Stress Analysis

Modular Credits: 4

Workload: 3-0-0.5-2-4.5

Pre-requisite(s): N/A

This is a basic module which aims at providing a good foundation and understanding of optical techniques for research and industrial applications. Newer optical methods such as holography, shearography and electronic speckle pattern interferometry (ESPI) developed for research and industrial use will be studied. Updated methods such as using laser and computer technology in moiré and photoelasticity will be treated. Such advances have brought optical techniques to a new dimension in measurement and non-destructive testing.

Module credits: 4

Workload: 2-0.5-0-1-6.5

Prerequisite(s): MLE3101

Surface analyses: X-ray photoelectron spectroscopy; secondary ion mass spectroscopy; Auger electron spectroscopy. Low energy electron diffraction; Energy dispersive X-ray analysis and Rutherford back-scattering; Vibrational spectroscopies: infrared spectroscopy and Raman spectroscopy; Electronic spectroscopy: absorption and fluorescence; Magnetic and magneto-optical characterization: vibrating sample magnetometry, magneto-electronic measurement, magneto-optical Kerr-effect.

Module credits: 4

Workload: 2-0.5-0-1-6.5

Prerequisite(s): MLE3104

Introduction to polymer physics: chain statistics, static light scattering, hydrodynamics of polymer solutions, thermodynamics of polymer solutions, polymer blends, solubility parameters and group contribution methods; Overview of selected topics in advanced and emerging specialty polymer science and technology; Current interests in nanopatterning and nanoimprinting, layer-by-layer polyelectrolyte assembly, advanced photoresists, liquid-crystalline polymer science and device technology, conducting polymer science and technology, semiconducting polymer device science and technology, polysiloxanes and microcontact printing, low-k (and high-k) dielectric materials.

Module credits: 4

Workload: 2-0.5-0-1-6.5

Prerequisite(s): MLE2101

Introduction to quantum chemistry and quantum electronics, band theory of solid materials, transport phenomena in solids from the microscopic viewpoint, random processes in solids, Monte-Carlo calculations of diffusion, introduction to the theory of phase transitions, crystal growth and precipitation, self-organization in open non-equilibrium solid state systems, molecular dynamics modeling of properties and processes in condensed materials. Learning objectives: Introductory knowledge on theory and modeling of solid state systems with the emphasis of nanomateirals. Target students: Students of Materials Science and Engineering and related disciplines.

Module credits: 4

Workload: 2-0.5-0-1-6.5

Prerequisite(s): MLE2101

Semiconductor surfaces and structures; Aspects of epitaxy in the growth of low dimensional III-V and Si based semiconductor materials; In-situ characterisation techniques and monitoring epitaxial growth by molecular beam epitaxy; Structural, kinematic theory of LEED and application of RHEED; Surface topography, composition and growth modes probed by STM, XPS and Auger spectroscopy; Layer by layer, layer-island and island growth; Problems of sensitivity and selectivity in the study of surfaces and interfaces.

Modular Credits: 4

Workload: 3-0.5-0-1-5.5

Prerequisite(s): MLE2105 or EE3406 or equivalent

Preclusion(s): Nil

Cross-listing(s): Nil

This module teaches materials aspects for a wide variety of photovoltaic devices covering conventional p-n junction cells based on Si wafers, amorphous or nanocrystalline Si, bulk heterojunction solar cells, nanostructured solar cells including dye-sensitised solar cells,
organic solar cells and quantum structured solar cells, etc. emphasising the materials science and engineering aspects of advanced photovoltaic devices. Therefore students will gain an understanding of the role of materials development and characterisation for current and emerging photovoltaic technologies. Specific objectives include understanding of the physics of photovoltaics, general working principles of individual photovoltaic devices, the roles of photovoltaic materials and how they are incorporated in various photovoltaic devices; attain an informed view on the current aspects of photovoltaic technologies and photovoltaic materials, ability to select materials for device application based on their optical, electrical properties.

Modular Credit: 4

Workload: 2.5-0.5-0.5-2-4

The objective of this module is to give students a strong materials science and engineering base to biomaterials engineering. The principles of materials science and engineering with particular attention to topics most relevant to biomedical engineering will be covered. This would include atomic structures, hard treatment, fundamental of corrosion, manufacturing processes and characterisation of materials. The structure-property relationships of metals, ceramics, polymers and composites as well as hard and soft tissues such as bone, teeth, cartilage, ligament, skin, muscle and vasculature will be described. Behaviour of materials in the physiological environment will be focus. The target students are those who have no background in materials science and engineering but would like to study to biomaterials as a subject in bioengineering.

Modular Credits: 4

Workload: 2-0.5-1-2-4.5

Prerequisite(s): BN3301

The module aims to provide the students with the background to understand and assess the currently applied basic principles of tissue engineering. Students would learn to (1) nurture an appreciation of how tissue engineering will influence health care in the next century, (2) acquire a basic understanding of the central principles of tissue engineering, (3) derive a working knowledge of how engineers can participate in tissue engineering research and commercial applications.

Modular Credits: 4

Workload: 3-1-0-3-3

Prerequisite(s): CM3181 or (ML3101, ML3102, ML3104 and ML3105) or by permission

Preclusions ML4223

This module introduces to process development and scale-up in the fine chemicals and bio-pharmaceutical industries. A process design software will be introduced to generate process flow sheets and to make economic evaluations of various alternative process designs. As background, the course reviews microbiology, biochemistry and genetics. This includes classification of the micro-organisms relevant for industrial fermentations (bacteria, yeasts, insect cells, hybridoma and mammalian cells), cell organelles, species specific differences, e.g., bacterial cell walls; drug action (explained on the examples of penicillin and vancomycin), the development of antibiotic resistance in bacteria. Other topics are: Transcription, translation, and posttranslational modifications of proteins (e.g., re-folding of inclusion bodies); genetically improved expression systems; growth curves of cell cultures; induction and harvesting. The unit operations of bioprocessing will be treated: fermentation (stirred fermenter; air lift reactor; immobilized cells) and various purification steps (downstream processing: cell disruption; dead end and tangential flow filtration, centrifugation, chromatography, final stabilization).

Module credits: 4

Workload: 2.5-1-0-1.5-5

Prerequisite(s): Senior standing in the host department or with consent of the instructor.

The course introduces students to the analysis and evaluation of the various polymer production/synthesis techniques and processing operations. It starts with a brief introduction on the polymerization kinetics and the various polymerization mechanisms. This is followed by the design of the polymerization reactors. Techniques for producing or synthesizing polymers on an industrial scale are then presented. The various processing methods such as extrusion, injection modeling, blow molding and film blowing for the polymers so produced are discussed. Detailed mathematical analyses of some process operations based on momentum, heat and mass transfer approaches are carried out. This module is targeted at senior chemical engineering students.

Module credits: 4

Workload: 2.5-1-0-1.5-5

Prerequisite(s): Senior standing in the host department or with consent of the instructor.

This module provides students with a broad spectrum of knowledge in the fundamentals of membrane science and engineering as well as in membrane applications for chemical, environmental and biomedical engineering. It starts with a discussion of various membranes and their applications. The general theory of membrane transport for pressure, concentration and electric field driven separation and purification processes are then introduced. The basic principles of membrane fabrication for symmetric, asymmetric and composite membranes are addressed. Membrane fouling, liquid membranes and facilitated transport are also discussed in order to broaden students' knowledge in membrane usage and functional membranes. To inspire students' interest in membrane applications for the life sciences, the module includes the study of membranes for controlled release devices, biomimetic and biological membranes. This module caters to chemical and environmental students who are interested in membrane separation.

Modular Credits: 4

Workload: 2.5-1-0-1.5-5

Prerequisite(s): MLE1101

This module provides students with an overview of semi-conductor processing with an emphasis on the role of chemical engineering principles. An overall view of manufacturing in the semi-conductor industry and the role of chemical engineers are given. The physics and materials aspects of solid-state devices are introduced with a view towards understanding their functions. The next part takes the students through the various processing events, starting with silicon wafer manufacture and continuing with diffusion, CVD, photolithography, etching and metallization. Chemical engineering principles are highlighted in each section. The module concludes with a description of process integration for device manufacture and a brief discussion about electronic packaging. This module is targeted at level 4 chemical engineering students.

Modular Credits: 4

Workload: 3-1-0-0-6

Prerequisite(s): MLE1101 or equivalent (EE2143, EE2004)

This module provides students with a working knowledge of thin film technology as this is applicable in the microelectronics industry. The emphasis is on the role of chemical and engineering science in materials processing. The module commences with an introduction to basic concepts in the kinetic theory of gases, thin film formation, vacuum technology and surface preparation. The next section covers a variety of thin film deposition techniques ? physical as well as chemical. Thin film processing and patterning is the next subject of discussion. In particular, process operations relevant to semi-conductor device manufacture are covered. Diagnostics and characterization of thin films is also presented with a view to familiarize students in state-of-the-art methodologies. The last part is devoted to an intensive study of thin film phenomena from a materials perspective. This module is targeted at level 4 chemical engineering students.

Module credits: 4

Workload: 2-1-1-3-4

Prerequisite(s): No programming or computer science experience is required. A-level Mathematics or MA1301

Preclusions: CS1101, CS1101S, IT1002

This module introduces the fundamental concepts of programming using an imperative programming language, and is perceived as the first and foremost introductory course to computing. It is the first of a two part series on introductory programming, which also includes CS1102C. Topics covered include: overview of programming languages and compilation process, algorithmic problem solving and design process, program development, coding and debugging, fundamental programming constructs (variables, types, expressions, assignments, functions, etc.), fundamental data structures: arrays, strings and structures, basic recursion, simple file processing, and introduction to dynamic structures using linked lists. Module activities include lectures, tutorials and laboratory exercises.

Modular Credits: 4

Workload: 2.5-0.5-0.75-2.0-4.5

Prerequisite(s): EE2004

Optoelectronics is the study of the interaction of light/radiation with the electronic properties of matter, which are mainly but not exclusively semiconductor-based. This module is designed with a logical mix of theory and application, emphasizing both the fundamental principles underlying device operation as well as relevant technological knowledge required in the photonics industry. At the end of the module, the student will be equipped with the basic physics of light production, emission and modulation, in semiconductors, electro-optic crystals and liquid crystal substances, and their application in display components and devices, and optical communications. Experiments on optical heterodyning, liquid crystal modulation and characteristics of semiconductor lasers and LEDs are included to provide practical hands-on experience to complement the lectures. Topics covered: Basic photometry and radiometry; Bandgap engineering in III-V and II-VI compound semiconductors; Exciton, isoelectronic traps; LED, semiconductor laser and photodetector device structure and operational characteristics; Optical modulators; Liquid crystal displays.

Modular Credits: 4

Workload: 2.5-0.5-1-1.5-4

Prerequisite(s): EE2004

This module focuses on the major process technologies used in the fabrication of integrated circuits and other microelectronic devices. Each lecture topic covers important scientific aspects of silicon wafer processing steps. Simulations and laboratory experiments provide hands-on experience on basic operation and fabrication of MOS devices. Topics include: crystal growth and wafer preparation, epitaxy, oxidation, diffusion, ion implantation, lithography, plasma technology, etching, deposition, and metallization.

Modular Credits: 3

Workload: 2-0.5-0.5-1.5-3

Prerequisite(s): EE3406

The recent emergence of fabrication tools and techniques capable of constructing nanometer-sized structures has opened up numerous possibilities for the development of new devices with size domains ranging from 0.1 - 50 nm. The course introduces new device concepts that take advantage of quantum mechanical phenomena on the nanometer scale, including the discreteness of confined states and electron charges. Topics covered: Nano-engineering and nanofabrication techniques, Heterostructure applications and devices: tunnel diods, HEMT, nanoelectronic devices including single-electron effect and its application in transistor and memory devices.

Modular Credits: 4

Workload: 2-0.5-0.5-3-4

Prerequisite(s): EE2004

This course is designed to provide a better understanding of the nature of magnetic materials and their use in magnetic information storage devices. Central to the understanding of the fundamentals of all magnetic materials used in modern devices is the concept of the magnetic domain. The study of these domains, the walls that form the boundary between two domains and their motion in a magnetic field is essential in understanding basic device principles. Students will be introduced to various applications such as magnetic random access memory devices and magnetic sensors. Topics covered: Basics of magnetization processes; Magnetostatic; Magnetic domain walls and domains; Magnetic anisotropy; Nanomagnetism; Micromagnetic modeling; Introduction to magnetoelectronic; Design of magnetoelectronic devices; Basic of magnetic media; Principles of media design; Fundamental limit of magnetic media; Future magnetic media.

Module credits: 3

Workload: 2-0.75-0.5-1.5-3

Prerequisite(s): A-level Physics

This module introduces basic concepts in electrical and computer engineering in an integrated manner. It motivates the understanding of basic concepts in the context of practical engineering applications. The main part of the course gives the students a very strong foundation in DC and AC circuit analysis. The rest of the course gives the students a good flavor of what electrical engineering is all about. This is done using simple application examples that demonstrate the importance of AC and DC analysis. The topics covered are: Kirchhoff's Current and Voltage Laws, Ohm's Law. Resistive networks. Ideal and real sources. AC Circuits: phasors, impedance, power, power factor, resonance. Energy storage elements: capacitors and inductors. Introduction to circuit concepts including diodes, operational amplifiers, transformers, DC machines and logic gates using applications.

Module credits: 4

Workload: 0-3-0-5-2

Prerequisite(s): A Pass or Exemption from English for Academic Purposes Modules

Preclusions: ES2000

This course aims to foster the critical thinking, reading and writing skills which engineering students need to be successful in the university and in the engineering profession. Learners are taught the fundamentals of analyzing written ideas/arguments of others and they simultaneously practice writing approaches typical of the academic and professional settings: exposition, evaluation, analysis, argumentation and research.

Module credits: 3

Workload: 3(sectional)-0-0-4-3

Prerequisite(s): For Engineering students

Preclusions: Students who have passed or are reading HR2001 or HR2101 or HR3111 are not allowed to take HR2002

This multi-disciplinary course in human relations management invites students to look, from different perspectives, at some major themes that constitute various challenges in the new economy. Students are led to examine the significance of social influences on individual behavior, thoughts and feelings. This theme is taken through to an exploration of ‘emotions’ and ‘diversity’ as social phenomena central to understanding and managing human relations at work. In the light of these, various aspects of the employment relationship are discussed. Through this thematic approach, students are also able to gain some insights into such group dynamics as communication, teamwork and motivation.

Module credits: 4

Workload: 3-1-1-0-6

Prerequisite(s): A-level Mathematics or [GM1101 and GM1102] or MA1301

Preclusions: MA1102, MA1102R, GM1306, GM1307, EE1401, EE1461, EG1401, EG1402, CE1402, MA1306, MA1505C, MQ1102, MQ1103, FASS students matriculated in 2001 or earlier

This module provides a basic foundation for calculus and its related subjects required by engineering students. The objective is to train the students to be able to handle calculus techniques arising in their engineering courses. In addition to the standard calculus material, the course covers simple mathematical modeling techniques in connection with ordinary differential equations, basic Fourier series methods, and an introduction to the Laplace transform.

Major topics: Sets: basic concept and notation. Number systems. Mathematical induction. Complex numbers, Argand diagram, trigonometric form of a complex number. Polar coordinates. De Moivre's theorem, nth-root of a complex number, Euler's formula. Calculus of functions of one variable. Limits of functions and sequences, types of limits, the sandwich theorem, evaluation of limits, continuity of functions,property of continuous functions. Derivatives, differentiability, rules and properties. Differentiation of transcendental functions. Higher-order derivatives. Implicit differentiation. Increments and differentials. Newton's method. Rolle's theorem, mean value theorem. Indeterminate form, l'Hopital's rule. Differential of arc length. Curve sketching, extreme values and points of inflection. Integration as antidifferentiation. Fundamental theorem of calculus. Basic rules of integration, integration of polynomial, trigonometric,exponential and logarithmic functions. Inverse functions. Integration by substitution, integration by parts. Riemann sum, trapezoidal and Simpson's rule, applications to area under a curve and volume of solid of revolution. Sequences and series. Tests of convergence and divergence Power series in one variable, interval of convergence, Maclaurin and Taylor series, Taylor's theorem with remainder. Fourier series: Euler formulas for Fourier coefficients of a function, half range expansions. Laplace Transform. Definition and properties. Inverse Laplace Transform.(description cont'd in Remarks column)

Remark: Solving initial value transforms of discontinuous and periodic functions. Method of Laplace Transform. Solution of initial value problems. Differential equations: separable and exact equations, first order linear differential equations, second order linear differential equations. Method of undetermined coefficients, variation of parameters. Solution of Differential Equations using Laplace Transform.

Module credits: 4

Workload: 3-1-1-0-6

Prerequisite(s): Read MA1102R or MA1505 or MA1505C or GM1307

Preclusions: MA1104, MA1104S, MA2221, PC1134, PC2201, EE1401, EE1461, EG1401, EG1402, CE1402, MQ2102, MQ2202, MQ2203, COM students who matriculated before 2004, FASS students who matriculated in 2001 or earlier

This course, together with MA1505, introduces students of engineering and physical sciences to those areas of mathematics which are important in connection with practical problems. The primary objective of this course is to give students in these disciplines a firm grounding in the fundamental mathematical principles needed for their further study of engineering and physical sciences.

This course emphasizes problem solving and mathematical techniques, and covers three important areas: (a) multivariate calculus and vector analysis; (b) linear algebra; (c) partial differential equations. Major topics: Vectors, dot and cross product, vector identities. Equations of lines and planes, applications in geometry and kinematics. Functions of several variables. Geometric interpretation, continuity, partial derivatives, chain rule. Directional derivatives, normal lines and tangent planes to surfaces. Extrema of functions: concavity and convexity. Vector Calculus. Curves, tangents and arc length. Gradient, divergence and curl. Line, surface and volume integrals. Green's theorem, divergence theorem, Stoke's theorem. Partial Differential Equations. Laplace's, heat, diffusion and wave equations. Separation of variables technique. Laplace transform solution of partial differential equations. Linear algebra. Matrix algebra, determinants, linear system of equations. Gaussian elimination. Matrix Inversion. Linear dependence and independence of vectors. Basis and dimension. Orthogonality. Rank of a matrix. Linear transformation. Eigenvalues and eigenvectors; applications to differential equation.

Modular Credit: 4

Workload: 3-0.5-0-2-4.5

Prerequisite(s): ME2151

The module educates students in the ways of applying fundamental materials science and engineering principles in order to solve challenging problems in medical related fields such as in implant and medical devices. It targets at students who wish to ensure a broad-based curriculum. Life science topics are introduced. Students gain an appreciation of a multidisciplinary approach to problem-solving. Topics include biological materials, metals, polymers, ceramics and composites use in implants, host-tissue response, materials selection, relationship between structure-composition-manufacturing process, mechanical testing and evaluation of implants and numerous case studies ranging from heart valves to tissue engineering of bones. A series of guest lectures from clinicians are included in this course.

Module credits: 4

Workload: 2-0.5-3-2.5-3

Prerequisite(s): ME3281

This module enables students to learn the micromachining of both Silicon and non-Silicon materials. The major topics include the basic micro-fabrication as well as the micro-machining processes for microsystems. Some of the processes to be covered: Bulk Processes; Surface Processes; Sacrificial Processes and Bonding Processes; Micro-machining based on conventional machining processes; Micro-machining based on non-conventional machining processes; Special machining; The module is targeted at students seeking to specialise in the Microsystems Technology.

Module credits: 4

Workload: 3-0.5-0-2-4.5

Prerequisite(s): ME2114, ME2151

This module introduces the design and manufacturing of IC packages, taking into consideration materials, mechanical, thermal, manufacturing, reliability and simple electrical aspects. The topics are covered: Introduction and overview of microelectronics packaging; Microelectronics packaging materials and applications; Electrical design consideration; Thermal design and management of electronics; Mechanical design considerations; Processing technologies in microelectronics packaging; Reliability considerations; Recent development in microelectronics packaging. This module is designed for upper year students who are interested in microelectronics packaging.

Module credits: 4

Workload: 3-1-0.5-2-4

Prerequisite(s): 'A' level pass in Physics

The module is designed to provide a clear and logical introduction to the concepts and principles of mechanics and thermodynamics, with illustrations based on applications to the real world. Topics covered include motion in one dimension; curvilinear motion; circular motion; relative motion; Newton's laws; friction; work and energy; conservative forces, conservation of energy; linear momentum and conservation, collisions; rotational kinematics; moment of inertia and torque; rotational dynamics; conservation of angular momentum; gravitational force, field and potential energy; planetary motion; temperature and the zeroth law, temperature scales; thermal expansion of solids and liquids; heat and internal energy, specific heat capacities, enthalpy and latent heat, work for ideal gases, first law of thermodynamics; equipartition of energy, mean free path; entropy and the second law, heat engines; entropy changes for reversible and irreversible processes. The module is targeted essentially at Engineering students.

Remark: Overlap PC1141 and PC1142

Module credits: 4

Workload: 3-1-0.5-2-4

Prerequisite(s): 'A' level pass in Physics

This module introduces fundamental concepts of physics and is illustrated with many practical examples. Topics covered include a) Electricity and magnetism, where the basic concepts of electric and magnetic fields, forces on charged particles, electric potential, electromotive force, work and energy, are described. The properties of basic electrical circuits comprising resistors, inductors and capacitors are discussed, along with analysis of their transient and steady-state behaviour. Understanding the role of Maxwell's equations in electromagnetism is emphasized; b) Waves, introducing properties of waves, including geometric optics, propagation, interference and diffraction, and electromagnetic waves; and c) Quantum physics, where new physics concepts which led to the quantization of energy are introduced, leading to an explanation of atomic transitions, atomic spectra and the physical and the chemical properties of the atom. The uncertainty principle, wave-mechanics and wave particle duality concepts are covered, together with the use of wavefunctions in predicting the behaviour of trapped particles. The module is targeted essentially at Engineering students.

Modular Credits: 4

Workload: 3-1-0-1-5

Prerequisite(s): PC3235, PC3241, or PC3242

The scope of the course embraces the basic principles of thin-film deposition techniques such as chemical vapor deposition and physical vapor deposition as well as their applications in the microelectronics industry. The basic principles include vacuum technology, gas kinetics, adsorption, surface diffusion and nucleation. These are the fundamental features which determine the film growth and the ultimate film properties. Common thin-film characterization methods which measure film composition and structure as well as mechanical and electrical properties are also covered. This course is for senior physics students with an interest in pursuing a career in industry.

Modular Credits: 4

Workload: 3-1-0-1-5

Prerequisite(s): PC3130 or PC3243

This module is aimed at students who wish to acquire to solid foundation and working principles of photonics devices for modern optical communications. Firstly, lasing threshold in laser oscillation, pumping and gain saturation, construction of laser resonators and Gaussian beam optics is discussed, leading to more advanced topics in spatial hole burning, optical output coupling, Q-switching and mode-locking of pulse lasers. This is followed by electro-optical and acousto-optical devices, photo-refractivity, photo-elasticity, optical switches, bi-stable optics and optical solitons. The course concludes with a section on optical fibres with practical issues including wavelength-division-multiplexing, modulation and coupling, system performance, receiver sensitivity and coherent optical communication.

Modular Credits: 4

Workload: 3-1-0-1-5

Prerequisite(s): PC3241

This course is a follow-up of PC3241 Solid State Devices and is designed for those intending to join the semiconductor industry. The course is intended to give the students an understanding of the physics behind selected devices and that of some of their fabrication technologies. Devices examined are: MOSC & MOSFET, CCD, majority carrier diodes, transferred electron devices, non-volatile memory devices, thyristors and heterojunction devices.

Remark Overlap: PC4251(old code)

Modular Credits: 4

Workload: 2-1-1-2-4

Prerequisite(s): PC3267, or Departmental Approval

This module introduces the techniques applied in biophysics and biomolecular electronics. It covers absorption and emission spectroscopy associated with biomolecules; infrared and Raman spectroscopy; magnetic resonance; symmetry of crystal, x-ray crystal structure analysis for macromolecular-structures; principles of light scattering, Rayleigh scattering, scattering from particles comparable to wavelength of radiation, static light scattering, dynamic light scattering, low angle X-ray/neutron scattering, scanning probing microscopy; chemical, somatic, and visceral receptors, elements of integrated technologies and applications for biosensors; bio-molecular devices, protein computer. There is a lab composnent included in this module. This module is targeted at both physics and non-physics students who already have basic knowledge in physics, electronics and molecular biology.